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NXP announced that it will acquire Austrian automotive software developer TTTech Auto for $625 million in cash. Headquartered in Vienna, Austria, TTTech Auto has established business relationships with many of the leading automotive Oems and is a leader in the innovation of unique safety-critical systems and middleware for software-defined vehicles (SDVS). After the deal closes, TTTech's management team and about 1,100 engineering employees will join NXP's automotive team, NXP said in a statement on Tuesday. The deal is subject to regulatory approval. TTTech Auto has established business relationships with many leading automotive Oems through its deterministic operating system and time-triggered Ethernet technology. This fits well with NXP's focus on central and domain controller chips. Market research firm S&P says the SDV (System Design verification) market will expand to 45 percent of global vehicle production by 2027, with a compound annual growth rate of 48 percent between 2024 and 2027. This has driven a fundamental shift in the architecture of new vehicles, with NXP launching the CoreRide platform in March last year to address the transition to SDVS, with TTTech Auto as its main partner to port its software to the S32 chip. The NXP CoreRide platform uses NXP's S32 vehicle computing, networking and system power management. The deal adds MotionWise middleware, communications and security technologies to the stack. In addition to TTTech Auto, NXP also acquired U.S.-based SerDes startup AvivaLinks for $242.5 million in cash on Dec. 18, 2024, and expects the acquisition to close in the first half of 2025. Aviva Links manufactures standards-based asymmetric multi-gigabit serializers (SerDes) for the Automotive SerDes Alliance's (ASA) standard for Interoperable network architecture. NXP's acquisition is expected to contribute to this growth by driving the market away from today's proprietary links towards open standard ASA SerDes connectivity. According to the latest forecast of World Semiconductor Trade Statistics (WSTS), global automotive chips, whose demand has been sluggish since 2022, will usher in the market's long-awaited "moment of recovery" in 2025. According to WSTS expectations, analog chips, which occupy an important share in the chips required for automobiles, especially electric vehicles (EV), are expected to slowly enter the recovery cycle in 2025 after two consecutive years of weak demand, and MCU demand, another important chip category required for electric vehicles, is expected to recover at a stronger pace on the basis of a slow recovery in 2024. Analog chips play an integral role in a variety of key functional modules and systems for electric vehicles, including power management, battery management, sensor interfaces, audio and video processing, and motor core control systems. With the organization's optimism about the automotive chip market, there is a market view that through a series of recent acquisitions, NXP has not only enhanced its capabilities in the automotive software field, but also accelerated the strategic layout of NXP's automotive hardware and software integration. This move is designed to respond to the coming recovery trend of automotive chip demand and the future development trend of "electric vehicle +AI autonomous driving" and software-defined vehicles, and enhance its competitiveness in the global automotive chip and automotive hardware and software integration market.

Founded in 1965,  Analog Devices, inc is a global leader in data conversion and signal processing technologies, and its products are widely used in communications infrastructure, industrial automation, industrial instrumentation, automotive electronics, and healthcare. The semiconductor industry is extremely competitive and the market concentration is high. The global analog semiconductor market is dominated by a handful of large players, and Adno Semiconductor faces strong pressure from competitors such as Texas Instruments. In order to stand out in the market and expand its market share, mergers and acquisitions and investment have become important means to enhance its competitiveness. In recent years, Adno Semiconductor has further consolidated its leadership position in analog semiconductors through a series of acquisitions and investment activities. ADI (NYSE: ADI) has a proven track record since its founding in 1965 as a preeminent supplier of semiconductor sensors and signal processing ics. ADI has made innovation, performance and excellence the pillars of its culture and has grown to be one of the most consistently high-growth companies in this technology. November 11, 2024, Analog Devices, Inc. Completed the acquisition of Flex Logix, an embedded FPGA and AI IP company. Flex Logix is a company focused on reconfigurable computing technology, founded in 2014, the company has a deep technical accumulation and rich product line in eFPGA, DSP/SDR and AI inference solutions, and its eFPGA technology can seamlessly integrate FPGA architectures into SOCs and AS ics. It can reduce the cost and power consumption of FPGas by 5 to 10 times and increase the compute density, which is critical for communications, networking, data centers, microcontrollers and other applications. The integration of Flex Logix's advanced technology will help Adno Semiconductor achieve breakthroughs in key technology areas such as reconfigurable computing and AI inference, enhance its competitiveness in emerging markets such as intelligent edge computing, and provide customers with more differentiated and innovative solutions. With Flex Logix's customer resources and market access, Adno Semiconductor can further expand its share in the global semiconductor market, especially in areas where there is a high demand for high-performance, low-power digital chips, such as 5G communications, data centers, industrial automation, etc., and consolidate its market leadership. In 2021, Analog Devices acquired Comcores' wireless infrastructure assets. Comcores is a leading provider of digital IP cores and subsystems for AS ics and FPgas, with a focus on communications technology and interface solutions. The acquisition enables Analog Devices to further expand its technology and solutions in wireless communications and enhance its capabilities in open, discrete wireless access network architectures to better meet the market demand for more cost-effective and agile networks. It lays a more solid foundation for the development of wireless communication technologies such as 5G and even 6G in the future. With this acquisition, Comcores' core team in Denmark and its office in Krakow, Poland, will become part of Adno's operations, which will help Adno integrate their technology and talent resources, accelerate the development and commercialization of related technologies, and further enhance its competitiveness in the global semiconductor market. On July 13, 2020, Analog Devices announced the acquisition of Maxim Integrated in an all-stock transaction for $20.91 billion, under which Maxim Integrated common stock will be exchanged for 0.63 Analog Devices shares per share. Analog Devices shareholders will own approximately 69 percent of the combined company, while MEC shareholders will own approximately 31 percent. August 26, 2021: Adno Semiconductor officially completes the acquisition of Meishin Integration. Analog chip market competition is fierce, TI occupies a leading position in this field, Analog Devices in order to further enhance market share and competitiveness, expand business scope and enhance technical strength, decided to acquire Meisen Integration. With the development of emerging technologies such as autonomous driving and 5G networks, the market demand for Analog chips is increasing, and this acquisition helps Analog Devices expand its business in these areas to better meet the market demand. Maxim integration has advantages in the automotive and data center markets, and after the acquisition, Analog Devices will be able to expand its business scope, especially in emerging areas such as autonomous driving and 5G networks, and its layout will be more complete to meet the diverse needs of different customers. After the merger, Analog Devices' global market share increased to approximately 13%, becoming the world's second largest analog chip designer, further changing the competitive landscape of the global analog chip market, increasing industry concentration and creating greater competitive pressure on other competitors.  

NXP Semiconductors N.V. is a leading global semiconductor manufacturer whose products include microcontrollers, processors, sensors, analog ics and connectivity modules for automotive, industrial, Internet of Things, mobile devices and communications infrastructure. It is one of the top ten semiconductor companies in the world. With industry changes and the rise of emerging markets, the automotive industry is developing rapidly in the direction of electrification, automation, intelligence and connectivity, and the demand for semiconductor technology is growing and becoming increasingly complex. The global semiconductor market is highly competitive, and various manufacturers are trying to compete for market share. In recent years, NXP has acquired more market resources and customer groups through a series of mergers and acquisitions and investment activities, enhanced its competitiveness in the market, and consolidated its market position in automotive electronics, Internet of things and other fields. NXP M&A events over the years NXP Semiconductors, formerly the semiconductor business of Philips, was founded in 2006. Since its inception, NXP has risen rapidly in the semiconductor market, particularly in areas such as automotive electronics, Internet of Things, security and identity. NXP's products are widely used in automotive, Internet of things, smart home and other fields, and is one of the world's leading semiconductor manufacturers ‌. Through mergers and acquisitions, NXP enters new business areas or market segments, quickly acquires key technologies, improves its technical strength, and expands its business territory. NXP acquires Aviva Links On December 17, 2024, NXP Semiconductors (NASDAQ: NXPI) announced that it has reached a definitive agreement to acquire Aviva Links, a U.S. startup focused on connectivity solutions for the automotive industry, in a $242.5 million all-cash transaction. With the increasing adoption of technologies such as advanced driver assistance systems (ADAS) and in-vehicle infotainment (IVI) in software-defined vehicles, and the increasing demand for highly asymmetric cameras and display networks with high downlink and low line bandwidths, the market requires more advanced open standard automotive connectivity solutions. As a practitioner of the Automotive SerDes Alliance (ASA) standard, Aviva Links has the industry's most advanced ASA compatible product portfolio, and its technology is highly compatible with NXP's strategic layout in the field of automotive network solutions. NXP hopes to further enhance its technical strength and market competitiveness in the field of automotive connectivity through the acquisition. Aviva Links' advanced technology will complement and extend NXP's product line in automotive networking solutions, enabling it to offer a more comprehensive range of networking solutions from CAN and LIN to Ethernet switches and physical layer devices. SerDes point-to-point (ASA-ML) and Ethernet-based connections (ASA-MLE) with data rates up to 16Gbps are supported. With this acquisition, NXP will further strengthen its global leadership position in automotive processing and networking, drive the market shift from proprietary solutions to open standard ASA SerDes links, help meet automotive manufacturers' needs for interoperable network architectures, and enhance its competitiveness in the automotive electronics market. The ADAS and IVI asymmetric link market is expected to grow from $1 billion in 2024 to $2 billion by 2034, and this acquisition is expected to drive this growth. After the acquisition, the knowledgeable team of Aviva Links will join NXP's automotive innovation team, and the two teams will collaborate on technology research and development, market expansion and other aspects to jointly promote the development of automotive connected technology. NXP acquires Freescale Semiconductor NXP acquired Freescale Semiconductor for $11.8 billion in 2015. At that time, the semiconductor industry was in a period of market adjustment, and emerging fields such as automotive electronics and the Internet of Things developed rapidly, and the market put forward higher requirements for the technology and market integration capabilities of semiconductor companies. NXP already has a certain advantage in the automotive semiconductor market, but wants to further expand its market share and technical strength; Freescale Semiconductor has rich technology and customer resources in the field of automotive electronics and industrial control, and was the fourth largest supplier of automotive electronics chips in the world before the acquisition, but faced certain pressure in terms of scale and market expansion. Following the acquisition, NXP becomes the world's largest manufacturer of automotive semiconductors and the market leader in automotive semiconductor solutions and universal microcontrollers (MCUS). Combining Freescale's technologies in automotive powertrain, body electronics, and safety systems with NXP's in-vehicle entertainment systems, automotive communication systems and other technologies, we can provide automakers with more comprehensive system solutions. Freescale's microcontrollers, sensors and other product technologies in the field of industrial control complement NXP's technology and product lines, and jointly enhance the market competitiveness in industrial automation, smart home, smart buildings and other fields. The integration of R&D resources from both sides has accelerated technological innovation in the field of automotive electronics and industrial control. For example, joint research and development in automotive chip manufacturing process, functional integration, reliability, etc., to launch more competitive products. The acquisition significantly increases NXP's share and position in the global semiconductor market, particularly in the fast-growing segments of automotive electronics and industrial controls.    

  Overheating of DrMOS devices affects the mass production of Nvidia's next-generation AI systems According to the latest investment research report by analyst Guo Mingchi, Nvidia is developing and testing DrMOS technology for its next-generation AI servers GB300 and B300, but encountered component overheating issues during the process. Specifically, the 5x5 DrMOS chip provided by AOS company has serious overheating issues, which may affect the production progress of the system and change market expectations for AOS orders. Guo Mingchi pointed out that Nvidia prioritizes testing AOS's 5x5 DrMOS, aiming to enhance bargaining power over MPS companies and reduce costs, as well as because AOS has rich experience in 5x5 DrMOS design and production. According to supply chain information, the overheating issue of AOS's 5x5 DrMOS is not only due to the chip itself, but also involves design deficiencies in other aspects such as system chip management. If AOS is unable to resolve this issue within the specified time frame, Nvidia may consider introducing new 5x5 DrMOS suppliers or switching to using 5x6 DrMOS. The latter has higher costs but better heat dissipation efficiency, which is beneficial for MPS company. The serious situation is that this issue may lead to a delay in the mass production of GB300/B300 systems.   Nvidia GB200 cabinets are expected to increase in volume as early as the second quarter of next year According to the Science and Technology Innovation Board Daily, TrendForce Consulting has recently conducted a survey and pointed out that the market is paying attention to the supply progress of Nvidia's GB200 rack solution. Due to the significantly higher design specifications of GB200 rack in high-speed interconnection interface and thermal design power consumption (TDP) compared to the mainstream market, supply chain operators need more time to continuously adjust and optimize. It is expected that there will be an opportunity to increase production as early as the second quarter of 2025.   UMC wins a large order for Qualcomm chip packaging, breaking TSMC's monopoly According to relevant reports cited by Fast Technology, UMC has won the advanced packaging order for Qualcomm's high-performance computing products, which are expected to be applied in the AI PC, automotive, and AI server markets, and even include the integration of HBM. At the same time, this also breaks the monopoly of a few manufacturers such as TSMC, Intel, and Samsung in the advanced packaging outsourcing market. At present, UMC mainly supplies intermediate layers in the field of advanced packaging, applied in RFSOI processes, with limited revenue contribution. However, Qualcomm's order has opened up new business opportunities for UMC. According to informed sources, Qualcomm plans to commission TSMC for mass production of a customized Oryon architecture core and UMC for advanced packaging. It is expected to use UMC's WoW Hybrid bonding process. Analysis suggests that Qualcomm will adopt UMC's advanced packaging technology, which will combine PoP packaging to replace the traditional solder ball packaging mode, shorten the signal transmission distance between chips, and improve chip computing efficiency. UMC has the equipment and TSV process technology to produce intermediate layers, which meets the prerequisite for mass production of advanced packaging processes. This is also the main reason why Qualcomm chose UMC.   NXP acquires automotive network technology supplier Aviva Links NXP announced the acquisition of Aviva Links, a provider of automotive SerDes Alliance (ASA) compliant in car connectivity solutions, in a $242.5 million all cash transaction. Aviva Links offers the industry's most advanced ASA compliant product portfolio, supporting SerDes point-to-point (ASA-ML) and Ethernet based connectivity (ASA-MLE), with data rates up to 16 Gbps. The company has achieved design victories in two major automotive OEMs and is providing its samples to various OEMs and first tier suppliers. The Automotive SerDes Alliance (ASA) was established in 2019, with NXP as a founding member, helping participating automakers migrate to open source, interoperable network solutions to best meet their growing demand for software defined automotive products. ASA provides an open standard that can scale data rates from 2 Gbps to 16 Gbps and includes link layer security. In addition to establishing SerDes point-to-point communication, this standard also solves the seamless migration problem to efficient Ethernet sensor connections. Ansenmei and Denso strengthen cooperation in the field of autonomous driving   Onsemi recently announced that it has strengthened its partnership with T1 automotive supplier Denso in the areas of autonomous driving and advanced driver assistance systems (ADAS) technology. For over 10 years, Ansenmei has been providing Denso with the latest intelligent automotive sensors to enhance ADAS and autonomous driving performance. These semiconductors are becoming increasingly important in enhancing vehicle intelligence, including connectivity, which will help reduce traffic injuries and accidents. As a sign of cooperation between the two parties, Denso plans to acquire shares of Ansenmei in the open market to further strengthen the long-term partnership.

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